State-of-the-Art in Low-Power Memory: Denali’s MemCon

June 30, 2009 on 4:06 pm | In DRAM, Flash, LPDDR, LPDDR2, Low-Power, SDRAM | No Comments

Need gobs of cheap RAM? Need it to operate at the lowest possible power? This blog’s for you.

I attended Denali’s ninth annual MemCon conference a few days ago. It was three days of intensive discussion about the state of the art in DRAM and Flash memory-the two mainstay memory technologies in use today. Surprisingly, NAND Flash memory is now the low-cost leader in terms of cost per bit, having passed by DRAM a few years ago. However, DRAM remains the mainstay memory for the vast number of designs and DDR SDRAM now rules as it becomes easier and easier to find microcontrollers and FPGAs with direct DDR interfaces and DDR controller and PHY IP for SOCs.

Memory power consumption as a percentage of system power consumption has grown with the rapid growth of memory-array size in all sorts of systems. A real eye opener at MemCon 09 was a chart on the power consumption of memory in server systems, where the large server memory arrays consume as much as 40% of the system power and the processor now consumes a mere 28%. Why is that important? It’s important because big server users like Google pay tens of millions of dollars each year in electrical power costs to run and to cool their server farms and 40% of a few tens of millions of dollars is, well, tens of millions of dollars.

Note that the current share-of-power percentages for servers don’t make processor power consumption unimportant-28% is still a big number-but the clear message is that server designers must now be far more concerned with memory power consumption because it’s a big part of the power puzzle. As embedded designs adopt large DDR memory DIMMs for bulk memory, the same sort of situation applies. Embedded designers must also be aware of the way their DRAM choices affect system power.

Marc Greenberg, Denali’s Director of Technical Marketing, gave a 2-hour tutorial on low-power DDR SDRAM on the first day of MemCon09. He threw up one slide that does a terrific job of putting all of the low-power SDRAM parts in perspective:

Low-Power DDR Selection Criteria

Low-Power DDR Selection Criteria

This slide shows the optimum type of SDRAM to use based on your design’s memory-capacity and speed requirements. I like this slide a lot because it helps you to pick from the wide array of DDR types and speeds. However, it seems that your selection job is about to become a lot simpler. Look what happens to the chart when you add in LPDDR2 memory:

Low-Power DDR Selection Criteria with LPDDR2

Low-Power DDR Selection Criteria with LPDDR2

LPDDR2 memory delivers the low-power goods by operating the SDRAM’s memory core and I/O at 1.2V, which is what you need to do to substantially cut memory power these days. Several manufacturers have announced LPDDR parts with I/O speeds to 400MHz/DDR800 and spec sheets for these parts are beginning to appear on DRAM vendor Web sites. LPDDR2 vendors with announced parts include Elpida, Hynix, Micron, and Nanya. Note that there’s also the possibility for existing LPDDR1 vendors to create parts that operate at 1.2V for similar power savings and that some of the soon-to-be-seen DDR3 parts may operate at 1.35V, which qualify them as low-power DRAMS.

In addition, there’s a spec for LPDDR2 non-volatile memory (LPDDR2-NVM) to allow LPDDR2 DRAM and Flash to be intermixed. The big advantage of Flash LPDDR2 is the very low standby power but Flash memory exhibits both read and write wear-out failure, so DRAM isn’t yet obsolete and you’ll likely need both memory types in your system design. The LPDDR2-NVM spec allows for I/O speeds to 533MHz/DDR1066 operation, but Greenberg says that the initial LPDDR2-NVM parts are likely to be slower than the maximum.

The Hubble Gets a Low-Power ASIC

June 28, 2009 on 1:35 am | In Hubble, Low-Power, Space | No Comments

As I watched Space Shuttle Atlantis pull away from a refurbished Hubble Space Telescope after a spectacular series of EVAs, I realized that it’s now time to look away from the spectacular in-orbit repair efforts of the astronaut/mission specialists and turn my attention to a bit of low-power high technology that went into Hubble during the repairs. Astronauts John Grunsfeld and Drew Feustel replaced four circuit boards in the Hubble’s disabled Advanced Camera for Surveys (ACS) with a new electronics module and an external low-voltage power supply. The existing 15V power supply, a dc-dc converter that had operated far beyond its MTBF rating, failed early in 2007. However, the ACS repair didn’t just replace the failed supply with a new external box; the astronauts also upgraded the ACS imaging system with a low-power ASIC.

Now ASICs are almost always designed for high-volume applications where the cost of the ASIC’s design can be amortized over a large number of chips. Almost always, but not always. In the case of the Hubble, the repair of the power supply required the replacement of the CEB (CCD Electronics Box), which includes the A/D conversion circuits for the ACS’ Wide-Field Channel (WFC) CCD imager. Markus Loose at Teledyne Scientific & Imaging realized that this repair was a prime opportunity for a low-power ASIC that he’d developed for other telescope imaging applications.

The ASIC is called SIDECAR (System for Image Digitization, Enhancement, Control And Retrieval). SIDECAR contains 36 analog digitizing channels for converting analog CCD signals into digital data streams. Each analog conversion channel on the SIDECAR ASIC consists of an analog preamp, a 16-bit/100KHz A/D converter, and a 12-bit/5MHz A/D converter. The AISC also contains a 16-bit, radiation-hardened microprocessor, memory, interfaces, digital I/O pins, and 20 DAC-driven analog output channels to bias the analog CCDs. Here’s a block diagram of the SIDECAR ASIC:

SIDECAR ASIC Block Diagram
SIDECAR ASIC Block Diagram

And here’s what the SIDECAR ASIC looks like in its Hubble packaging:

SIDECAR ASIC used in Hubble upgrade

SIDECAR ASIC used in Hubble upgrade

In low-power mode, the ASIC draws a mere 11 mW. Now low power is the omnipresent watchword for earthbound applications these days but it’s even more important for the SIDECAR ASIC’s intended platform—the infrared James Webb Space Telescope—where it will be used in the Webb’s Near Infrared Camera (NIRCam) and the Near Infrared Spectrograph (NIRSpec). A hot conversion chip radiating IR cannot be tolerated in applications where sensitive imagers are trying to resolve a few infrared photons from faint, distant stars. The SIDECAR ASIC will also be used in the Webb’s fine guidance sensors. It’s a versatile chip design; The hallmark of a good ASIC. It’s the low-power, low-weight, and space-saving aspects of SIDECAR that make the ASIC attractive for space applications, not its cost. NRE amortization doesn’t play a role here.

Although originally designed for the James Webb telescope, Teledyne’s SIDECAR ASIC has now found its way into the Hubble. In addition, four SIDECARs were installed in early 2007 into the imaging system of the University of Hawaii’s 2.2 meter telescope on Mauna Kea. Like all well-designed ASICs, the Teledyne SIDECAR seems to have established itself as the standard part for high-end scientific imaging applications. When it’s fully tuned up inside of Hubble, it’s possible that the SIDECAR ASIC will pull more and better images from the ACS’ Wide-Field Channel CCD with less noise. Let’s hope so.

Here are some links if you want to get much more detained info on the SIDECAR ASIC and the ACS Repair (ACS-R) mission:

Amazing Miniaturized ‘SIDECAR’ Drives Webb Telescope’s Signal

Updates on ACS-R, PowerPoint presentation by Marco Sirianni

Imaging Sensor Technologies for Astronomy, Planetary Exploration & Earth Observation, PowerPoint presentation by James Beletic

SIDECAR ASIC Product Brief

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