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Industry News

Silicon Labs Announces Customer-Friendly Microcontroller Die Sales Program
Silicon Laboratories Inc. today introduced a customer-friendly microcontroller (MCU) die sales program, accelerating time to market and giving customers another option for small-footprint designs. More...


EVE’s Hardware-Assisted Verification Platform Accelerates Embedded Software Development for Texas Instruments’ OMAP 5 Platform
EVE confirmed today that Texas Instruments Incorporated used its ZeBu-Server (for Zero Bugs) hardware-assisted verification platform to accelerate development of its embedded software for the OMAP 5 platform. More...


Synopsys Acquires RSoft Design Group
Synopsys, Inc. today announced it has completed the acquisition of privately held RSoft Design Group, Inc., a leading provider of photonics design and simulation software headquartered in Ossining, New York. More...


Fujitsu Semiconductor Adopts Cadence Chip Planning System for MCU Chips at Its Design Centers Worldwide
Cadence Design Systems, Inc. today announced that Fujitsu Semiconductor Limited has adopted the newly updated Cadence Chip Planning System at its nine design centers spread around the globe. More...


Clearwire Expands LTE Choices in North America
Qualcomm Incorporated and Clearwire Corporation today announced that Qualcomm will add support for Clearwire's upcoming LTE TDD network to its line of multi-mode LTE chipsets with the inclusion of support for 3GPP's Band 41 (B41) radio frequency. More...


Microchip Technology and SMSC Announce the Acquisition of SMSC by Microchip Technology
Microchip Technology Incorporated today announced that Microchip has signed a definitive agreement to acquire Standard Microsystems Corporation for $37.00 per share in cash, which represents a total equity value of about $939 million, and a total enterprise value of about $766 million, after excluding SMSC’s cash and investments on its balance sheet of approximately $173 million. More...


Cadence OrCAD Capture Marketplace Now Available on Desktop Browsers
Cadence Design Systems, Inc. today announced the availability of its ground-breaking Cadence OrCAD Capture Marketplace to the entire OrCAD and Allegro PCB design community through a standard desktop browser, as well as the addition of several new apps and a trial period for paid apps. More...


Cadence Low-Power, Advanced-Node Digital Technology Incorporated Into SMIC 40nm Reference Flow
Cadence Design Systems, Inc. announced today that China's Semiconductor Manufacturing International Corporation has introduced a low-power, advanced-node IC design reference flow using Cadence Encounter digital technology and SMIC's 40-nanometer manufacturing process. More...


Wireless Network Worst Case Scenario: 25 Trillion Signaling Events at Once!
There’s a potentially devastating wireless signaling storm brewing, and SEVEN Networks, a provider of innovative mobile solutions that reduce smartphone data traffic on wireless networks, has released a new infographic depicting the mounting problem that is plaguing wireless networks across the globe. More...


Algotochip Industry’s First Company to Delivers Complete SoC GDSII From C Models of Algorithms
Algotochip today announced delivery of a SoC silicon solution for mimoOn’s mi!MobilePHYTM reference chain. mimoOn, the definitive leader LTE software products for software defined radio platforms, delivered fully functional reference code for the LTE UE PHY standard to Algotochip. More...


ST-Ericsson announces new strategic direction and partnership
ST-Ericsson announced today the guidelines of its new strategic direction, the signature of an agreement to transfer to STMicroelectronics its stand-alone application processor activities, and additional measures to accelerate time-to-market and lower the breakeven point. More...


Microchip Technology Acquires Roving Networks
Microchip Technology Inc. analog and Flash-IP solutions, today announced the acquisition of Roving Networks. Roving Networks is a privately held, fabless semiconductor developer of Wi-Fi certified transceivers and FCC certified Wi-Fi and Bluetooth modules. More...


4th Asia Symposium on Quality Electronic Design (ASQED2012)
July 10-11 2012
Penang, Malaysia
http://www.asqed.com
PAPER SUBMISSION DEADLINE: April 23, 2012
The Asia Symposium on Quality Electronic Design, a leading international conference in electronic design, semiconductor, and manufacturing, is now accepting papers in the following areas More...


Mentor Graphics Moves BridgePoint UML Editor to Open Source Domain
Mentor Graphics Corp. announced its intention to place the front-end UML editor of its powerful BridgePointT xtUML environment into the open source domain. More...


Vishay Intertechnology Launches PowerCAD Online Simulation Tool for Point-of-Load DC/DC Circuits
Vishay Intertechnology, Inc. today introduced the PowerCADSimulation tool, a free online tool that gives engineers a fast and convenient way to test and optimize DC/DCcircuits built with Vishay Siliconix regulator ICs. More...


Peregrine Semiconductor Achieves ISO/TS 16949 Quality System Certification
Peregrine Semiconductor Corporation, a leading provider of high-performance radio-frequency (RF) integrated circuits today announced that it has achieved its ISO/TS 16949:2009 certification. More...


Imec releases industry’s first 14nm process development kit
Imec has announced that it has released an early-version PDK (process development kit) for 14nm logic chips. More...


European project reaches milestone bidirectional communication for thin-film RFIDs, enabling item-level RFID tags
Imec, Holst Centre and their partners in the EU FP7 project ORICLA have fabricated the world’s first RFID circuit made in low-temperature thin-film technology that allows reader-talks-first communication. More...


Mentor Graphics Drives Broader Adoption of UVM
Mentor Graphics Corporation today announced expanded support for the Universal Verification Methodology (UVM). More...


Agilent Technologies Completes Acquisition of Accelicon Technologies’ Solutions for Semiconductor Device Modeling
Agilent Technologies Inc. today announced that Accelicon Technologies’ software solutions and technology for device-level modeling and validation in the electronics industry are now part of Agilent. More...


Power Integrations Launches Convenient Online Selection Tool for LED Driver Reference Designs
Power Integrations today launched an online selection tool that enables users to rapidly identify the best power supply reference design for their LED lighting application. More...


Cadence Collaborates with Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32, 28- and 20-Nanometer Chip Design
Cadence Design Systems, Inc. today announced that Samsung Electronics’ Foundry business, Samsung Foundry, has collaborated with Cadence to develop a world-class design-for-manufacturing infrastructure to produce the most advanced chips. More...


Multiple Chip Architectures Pursue the $14 Billion Small Cell Market, Says NPD In-Stat
Mobile data usage nearly doubles each year, but mobile operators cannot increase expenditures at that rate. At the same time, data rates (a key metric of perceived quality) are affected by the proximity of a device to a cell. More...


Imec and Genalyte report disposable silicon photonics biosensor chips
Imec and Genalyte announce that they have successfully developed and produced a set of disposable silicon photonics biosensor chips to be used in Genalyte diagnostic and molecular detection equipment. More...


Mentor Graphics Acquires the Flowmaster Group to Provide a Unique Combination of CFD Capabilities
Mentor Graphics Corporation today announced that it has acquired the Flowmaster Group, a global leader in 1D Computational Fluid Dynamics (CFD) simulation software for system design. More...


Multiple Chip Architectures Pursue the $14 Billion Small Cell Market, Says NPD In-Stat
This fourth annual conference will include three tracks - one focused on SDR technologies, one focused on Cognitive Radio and Dynamic Spectrum Access technologies, and one focused on CR and SDR programs and requirements. More...


GLOBALFOUNDRIES and ARM Deliver Optimized SoC Solution based on ARM Cortex-A Series Processors
GLOBALFOUNDRIES and ARM today revealed the latest advances in their longstanding collaboration to deliver optimized system-on-chip solutions for ARM Cortex-A series processor designs using ARM Artisan advanced physical IP and GLOBALFOUNDRIES’ leading-edge process technologies. More...


2012 Global Energy Prize Now Accepting Nominations
The Global Energy Prize, one of the world’s most respected awards in energy science, is now accepting nominations for its over $1 million 2012 award. More...


Accellera and Open SystemC Initiative (OSCI) Approve Merger, Unite to Form Accellera Systems Initiative
Accellera and the Open SystemC Initiative (OSCI) announced that their members and Boards have approved their merger, and they have united to form Accellera Systems Initiative. More...


Agilent Technologies and Lime Microsystems Create New Method for Testing Advanced Wireless Systems
Agilent Technologies Inc. and Lime Microsystems today announced a custom pairing of test equipment, transceiver technology and control software that constitutes a new method for testing and evaluating advanced wireless systems. More...


Renesas Electronics Introduces IGZO Bridging Interface for Analog and Power Devices in Smart Systems at IEDM 2011
Renesas Electronics Corporation today announced the development of a new interface technology that enables simple and reliable signal controls for on-chip, high/low voltage bridging between analog and power devices and microcontrollers or systems-on-chip. More...


Open Source Framework for Commercial Baseband Software Project Initiated by Wireless Innovation Forum Members
The Wireless Innovation Forum (SDR Forum version 2.0) announced today a new project focused on reducing cost and time to market in deploying 3G and 4G, “3G+” systems, including: Fixed WiMAX (802.16d), Mobile WiMAX (802.16e), WiMAX-Advanced (802.16m), LTE (3GPP Release 8) and LTE-Advanced (3GPP Release 10). More...


Ideal Power Converters Announces First Commercial Installation of Revolutionary Solar Inverter at UTSA
Ideal Power Converters (IPC) is pleased to announce the first commercial installation of its revolutionary photovoltaic (PV) inverters at The University of Texas at San Antonio (UTSA). More...


Mentor Graphics Integrates Inflexion UI into GENIVI-Compliant Embedded In-Vehicle Infotainment (IVI) Base Platform
Microchip Technology Inc. today announced a worldwide series of technical training seminars that will show designers how to easily adapt to changing product requirements by migrating a real-world application from 8, to 16, to 32-bit PIC microcontrollers. More...


Announcing the 23rd Annual PCB Technology Leadership Award Winners
Continuing in its tradition of promoting and recognizing printed circuit board (PCB) design excellence, Mentor Graphics will announce the winners of this year’s TLA contest. More...


Request for Proposal for Webinar Presentations
Submit your proposal today for the Wireless Innovation Forum's new Webinar Series! The next round of Webinars is planned to begin in January 2012. More...


Microchip Launches Global Technical Training Series That Shows How to Easily Move Applications Among 8, 16 and 32-bit PIC MCUs
Microchip Technology Inc. today announced a worldwide series of technical training seminars that will show designers how to easily adapt to changing product requirements by migrating a real-world application from 8, to 16, to 32-bit PIC microcontrollers. More...


SOI Industry Consortium publishes technical paper on porting semiconductor designs from bulk silicon to FD-SOI
A group of leading semiconductor companies have developed a roadmap for leveraging CMOS designs intended for manufacturing on bulk silicon to fabricate ICs on fully depleted silicon-on-insulator (FD-SOI) substrates with ultra-thin buried oxide layers, producing chips with improved performance and lower operating power. More...


European collaboration towards efficient, low-cost tandem organic solar cells
Imec and its 16 project partners have announced that they have launched the European FP7 project X10D, a project aimed at developing tandem organic solar cells with an increased conversion efficiency and lifetime, and a decreased production cost. More...


X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications
X-FAB Silicon Foundries today announced the new technology platform XP018, its latest foundry process with the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash. More...


Redpine Signals and Grid2Home Partner to Offer SEP 2.0 Profile over 802.11n Wi-Fi
Redpine Signals, Inc., and Grid2Home, Inc., today announced the offering of Smart Energy Profile 2.0 (SEP 2.0) over 802.11n Wi-Fi solutions from Redpine. More...


Open-Silicon Launches ARM Center of Excellence
Open-Silicon, Inc. today announced the launch of its ARM Center of Excellence. More...


ARM and Cadence Achieve Industry Milestone with Tape Out of 20nm ARM Cortex-A15 MPCore Processor
ARM and Cadence Design Systems, Inc. today announced the tape out of the industry’s first 20nm design based on the ARM Cortex-A15 MPCore processor. More...


Freescale licenses ARM Cortex-A7 and Cortex-A15 processor cores for future generations of i.MX products
Freescale Semiconductor has licensed the new, ultra-efficient ARM Cortex-A7 MPCore processor in conjunction with the previously licensed Cortex-A15 processor. More...


2011 Wireless Innovation Forum Conference on Communications Technologies and Software Defined Radio (SDR’11-WInnComm) Announces Exceptional Technical Program
The Wireless Innovation Forum  today announced an exceptional program for its 2011 Wireless Innovation Forum Conference on Communications Technologies and Software Defined Radio. The premier event for the reconfigurable radio community, SDR’11-WInnComm will be held 29 November to 2 December in Washington, D.C. More...


Leaders in Advanced Radio Technologies to Provide Keynotes for SDR’11-WInnComm
The Wireless Innovation Forum (www.WirelessInnovation.org) today announced an impressive keynote lineup for its 2011 Wireless Innovation Forum Conference on Communications Technologies and Software Defined Radio (SDR'11-WInnComm). More...


ISQED final call for papers - deadline Oct. 16
13th International Symposium & Exhibits on QUALITY ELECTRONIC DESIGN - ISQED 2012 More...


Mentor Graphics Collaborates with Freescale Semiconductor to Accelerate In-Vehicle Infotainment Product Development for the i.MX6 Series of Applications Processors
Leveraging its expertise in transportation design technology, Mentor Graphics Corporation today announced it is collaborating with Freescale Semiconductor to provide the Mentor Embedded Linux In-Vehicle Infotainment (IVI) Base Platform for the Freescale i.MX6 series of scalable, multicore ARM Cortex A9-based processors. More...


Imec demonstrates CMOS integrated poly-SiGe piezoresistive pressure sensor
Imec realized an integrated poly-SiGe-based piezoresistive pressure sensor directly fabricated above 0.13 µm copper (Cu) -backend CMOS technology. More...


Wireless Innovation Forum Members Approve Five Documents Advancing Software Defined Radio, Cognitive Radio and Dynamic Spectrum Access Technologies at 70th Working Meeting
The Wireless Innovation Forum announced today the approval of five documents by its membership at the 70th Working Meeting held in Montreal September 12-15. More...


Fujitsu Selects Mentor Graphics Sourcery CodeBench for FM3 Microcontroller Family Embedded Development
Fujitsu Semiconductor Europe and Mentor Graphics Corporation today announced that Fujitsu has chosen the Mentor Embedded Sourcery CodeBench for ARMR EABI (embedded application binary interface) to support Fujitsu's FM3 CortexT-M3 microcontrollers and hardware evaluation boards.   More...


Cadence Accelerates Adoption of Emerging Mobile Standards with Expanded Verification IP Portfolio
Cadence Design Systems, Inc. today announced new protocol and memory model verification IP (VIP) that will accelerate the adoption of the latest mobile standards.   More...


Skyworks Captures Leadership Position in Wireless Networking Market
Skyworks Solutions, Inc. today announced that it has captured the market leader position in wireless networking with the acquisition of SiGe Semiconductor.   More...


Texas Instruments completes acquisition of National Semiconductor
Texas Instruments Incorporated (TI) today announced the acquisition of National Semiconductor is complete.  More...


Mentor Graphics Adds User Defined Fault Models and Cell-Aware ATPG to Improve IC Test Quality
Mentor Graphics Corporation today announced new capabilities in the Tessent TestKompress and the Tessent FastScan tools that enable higher defect coverage and lower defect per million (DPM) levels for quality-critical applications like military, medical, automotive, and many others. More...


Mentor Graphics and TSMC Address Advanced Node Fill Requirements Using Calibre SmartFill
Mentor Graphics Corporation today announced a collaboration with TSMC to support SmartFill functionality in the Calibre YieldEnhancer product for TSMC’s manufacturing processes starting at 65nm. More...


IAR Systems acquires Signum
“More powerful processors and increasingly complex embedded systems are driving the need for more advanced tools for testing and debugging,” says Stefan Skarin, CEO, IAR Systems. More...


EtherWaves Adds Support for Tensilica Dataplane Processor Cores
EtherWaves today announced the further expansion of the ClearSignal software-based DAB/DMB solution, by porting to Tensilica's Xtensa dataplane processor architecture. More...


Sandisk Drives SATA Low Power Industry Initiative for Mobile Computing Devices
SanDisk Corporation today announced that it is driving an industry initiative with other industry leaders that will enable OEMs to offer SSDs with SATA performance at significantly lower power consumption than current offerings. More...


X-FAB Extends High-Temperature Foundry Offering to Enable Emerging Power Management Applications
Addressing its customer needs, X-FAB Silicon Foundries today announced its enhanced XA035 high-temperature 0.35 micrometer foundry process with 28 new devices. More...


Cadence and GLOBALFOUNDRIES Significantly Speed Design for Manufacturing Signoff at 32, 28 Nanometers
Cadence Design Systems, Inc. today announced that it has teamed with GLOBALFOUNDRIES to dramatically reduce the turnaround time for design-for-manufacturing (DFM) signoff at 28 nanometers. More...


Calypto Design Systems Acquires Mentor Catapult C Synthesis Tool
Calypto Design Systems today announced it has acquired Catapult C Synthesis from Mentor Graphics Corporation. More...


Industry leaders predict a 'White Space economy'
Cambridge Consultants has today released a report discussing the foremost business opportunities in wireless technologies enabled by White Space frequencies, predicting the development of the first White Space consumer devices in the next five years. More...


Silicon Labs Targets Next-Generation TV Tuner IC for Massive China TV Market
Silicon Laboratories Inc. today introduced a silicon TV tuner solution designed to provide an optimal balance of affordable cost and high performance for TV makers in China and Taiwan. More...


Small Business Spending on Wireless Services to Overtake Wireline Voice in 2012
It has always been predicted that small business expenditures on wireless services would someday exceed that of wireline voice. More...


ANSI and IREC to Pursue Joint Accreditation Program to Bolster Workforce Readiness for Clean Energy Economy
The American National Standards Institute (ANSI), coordinator of the U.S. voluntary standardization system, has announced a partnership with the Interstate Renewable Energy Council (IREC) designed to help bolster the American workforce for the growing number of clean energy jobs of the future. More...


Energy Harvesting Markets Analysed: Creating a $4.4 Billion Market in 2021
In 2011, IDTechEx research finds that the amount of money spent on energy harvesters will be $0.7Bn, with several hundred developers involved throughout the value chain. More...


Marvell Smart-Energy Platform Enables Smart-Energy Profile 2.0 Devices
Marvell today announced that the company will be demonstrating its Smart-Energy Platform, which has been extended to support the Smart-Energy Profile 2.0 (SEP 2) Draft Standard, at the Wi-Fi Smart Energy Forum in Chicago, August 2-3, 2011. More...


TI achieves certification of ZigBee Alliance’s Smart Energy 1.1 profile implementation
Texas Instruments Incorporated (TI) today announced that it achieved ZigBee Certified status for its ZigBee Smart Energy 1.1 standard implementation, recently introduced by the ZigBee Alliance. More...


Industry-Standard Performance Test from EEMBC Answers 'How's Your Mobile Device?'
The Embedded Microprocessor Benchmark Consortium (EEMBC) today announced that it has launched its standardized, industry-accepted method of evaluating portable connected devices, with a primary focus on Web-browser performance. More...


Mentor Graphics Announces Comprehensive Embedded Software Development Program for Hardware Companies
Mentor Graphics Corporation today announced a new program composed of the Mentor Embedded professional services and products specifically for hardware companies. More...


Taking it to the Nth Degree: 802.11n-Enabled CE Unit Shipments to Increase 465% From 2010 to 2015, Says In-Stat
The year 2010 continued a shift toward consumer electronics (CE) devices with networking capabilities, allowing more devices to directly connect to the Internet or to a home network. More...


Microsemi Corporation Announces Proposal to Acquire Zarlink Semiconductor, Inc. for CAD $3.35 in Cash, Updates Guidance
Microsemi Corporation announced today that it has made a proposal to the board of directors of Zarlink Semiconductor Inc. to acquire all of the outstanding shares of the Company for CAD $3.35 per share in cash. More...


Calypto Joins ARM Connected Community
Calypto Design Systems, Inc. today announced it is a new member in the ARM Connected Community, the industry’s largest ecosystem of ARM technology-based products and services. More...


Wireless Innovation Forum Approves Model for Coordination of International SCA Standards at Working Meeting
The Wireless Innovation Forum announced the approval of a recommendation, “Model for Coordination of International SCA Standards,” and the advancement of key projects advancing software defined radio, cognitive radio and dynamic spectrum access technologies during its 69th Working Meeting in Brussels, Belgium, June 20-22. More...


Cadence Acquires Azuro
Cadence Design Systems, Inc. today announced it has acquired Azuro, Inc., a company that has pioneered a paradigm shift in the digital implementation and optimization of next-generation SoCs. More...


Cadence Donates UVM World Website to Accellera
Cadence Design Systems, Inc. today announced that it has donated the UVM World Website (www.uvmworld.org) to the Accellera standards organization. More...


Silicon Labs Ships One Billion Broadcast Radio ICs Based on Pioneering Digital Architecture
Reaching a major milestone in the broadcast audio market, Silicon Laboratories Inc. today announced that it has shipped its one billionth broadcast radio IC. More...


Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si
Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. More...


National Instruments to Acquire AWR Corporation, a Leader in RF Design Tools
National Instruments today announced that it has signed a definitive merger agreement under which NI will acquire AWR Corporation (AWR). More...


Xilinx Acquires Sarance Technologies
Xilinx, Inc. today announced its acquisition of Sarance Technologies, completing its industry-leading technology portfolio for addressing next generation line card applications by adding premier connectivity communications capabilities. More...


Cadence and TSMC Collaborate to Deliver DFM Services for TSMC Advanced Processes
Cadence Design Systems, Inc. today announced it has collaborated with TSMC to deliver their customers DFM expertise and technology in a service model. More...


Worldwide Smartphone Chip Revenue CAGR to Approach 21% 2009–2015, Says In-Stat
There is little question that smartphone shipments are increasing by leaps and bounds every year, and that these devices are being enabled with more processing power to perform complex tasks on multiple technologies. More...


TI introduces OpenLink, open source wireless connectivity solutions for low power applications
Texas Instruments Incorporated today announced delivery of a mobile-grade, battery-optimized Wi-Fi solution to the open source Linux community as part of the OpenLink project, focused on providing a wide range of wireless connectivity solutions for native Linux. More...


Over 225 Million Tablet PC Image Sensors to Ship Using MIPI in 2016, Says In-Stat
Image sensor interfaces have historically been proprietary and/or parallel. But increasing demand for higher image resolutions is pushing the bandwidth capacity of processor-to-camera sensor interfaces beyond their capability to perform effectively. More...


TI to acquire National Semiconductor
Texas Instruments Incorporated (TI) and National Semiconductor today announced they have signed a definitive agreement under which TI will acquire National for $25 per share in an all-cash transaction of about $6.5 billion. More...


GLOBALFOUNDRIES enters a broad strategic partnership with imec
GLOBALFOUNDRIES has signed a strategic long-term partnership on sub-22nm CMOS scaling and GaN-on-Si technology with the nanoelectronics R&D center imec. More...


TEAL Electronics Receives $1M Order for Solar Power Product
TEAL Electronics is pleased to announce the receipt of a $1M order from Energy Innovations, another local San Diego company, for product designed specifically for the Solar Power market. More...


Mentor Graphics Tessent YieldInsight Demonstrates Faster IC Failure and Yield Analysis at Fujitsu
Mentor Graphics Corporation today announced evaluation results at Fujitsu Semiconductor Ltd. that shows the Tessent YieldInsight diagnosis-driven yield analysis tool can help cut the time required to determine the cause of IC yield loss. More...


Dr. R. Fabian W. Pease Receives International Society for Quality Electronic Design’s 2011 Quality Award
The International Society for Quality Electronic Design today announced the winner of the 2011 prestigious Quality Award (IQ-Award 2011). More...


MIPI CSI-2 Penetration to Surpass 70% in Computing and Consumer Electronic Devices with Image Sensors by 2016, Says In-Stat
Image sensor interfaces have historically been proprietary and/or parallel. But increasing demand for higher image resolutions is pushing the bandwidth capacity of processor-to-camera sensor interfaces beyond their capability to perform effectively. More...


ON Semiconductor Releases Power Factor Correction Handbook
ON Semiconductor today announced the release of the updated edition of its Power Factor Correction (PFC) Handbook. More...


ON Semiconductor Completes Acquisition of CMOS Image Sensor Business Unit from Cypress
ON Semiconductor has completed its acquisition of the CMOS Image Sensor Business Unit (ISBU) from Cypress Semiconductor in an all cash transaction for approximately $31.4 million, subject to adjustment under the purchase agreement. More...


Express Logic's PrismX GUI Toolkit Brings Leading-Edge GUIs to STM32 Platform
Express Logic, Inc. and Blue Water Embedded today announced the availability of the PrismX graphics toolkit for the STMicroelectronics STM32processor family. PrismX delivers the eye-catching graphical capabilities and time-to-market edge needed for medical, industrial, office automation and consumer markets where user interfaces play an essential role in device design. More...


In-Wheel Electric Motors
In-wheel motors were popular in cars over 100 years ago because they did not intrude into passenger space. An example is shown below. However, they were expensive and they adversely affected the ride and steering. One motor seizing could sometimes lock a wheel. More...


Imec reports reconfigurable radio solutions enabling low-power spectrum sensing and low cost
Imec presents a digital front-end component for low-cost and low-power spectrum sensing, paving the way to power-efficient cognitive radios and networks. The new results support industry’s search for increased flexibility and reliability for their next-generation wireless devices. More...


Skyworks Powering Multiple LTE Platforms
Skyworks Solutions, Inc. today announced that its extensive LTE product portfolio continues to gain traction with leading handset OEMs and smart phone providers and is at the heart of several new, yet unreleased 4G devices slated for launch later this year. More...


MediaTek Adopts Mentor Graphics Calibre PERC as its ESD and Circuit Reliability Verification Solution
Mentor Graphics Corporation today announced that MediaTek, Inc. has adopted the CalibreR PERC product as its solution for electrical rule checking (ERC) to help ensure comprehensive electrostatic discharge (ESD) protection and increase overall product reliability. More...


Power.org news - first Android operating system port available as open source code
Power.org, the open collaborative organization that enables, develops and promotes Power Architecture technology, announces the first Android operating system (OS) port available as open source code for the embedded community. More...


VIA Technologies Adopts Mentor Graphics Calibre PERC for Critical ESD Checking
Mentor Graphics Corporation today announced that VIA Technologies, Inc. is adopting the CalibreR PERC electrical rule checking product to ensure that electrostatic discharge (ESD) protection meets established guidelines to help prevent circuit failures and design re-spins. More...


Accellera Approves New Version of Electronic Design System Modeling Standard
Accellera announced today that its Board of Directors approved a new version of Accellera's Standard Co-Emulation Modeling Interface (SCE-MI) specification as a new Accellera verification standard. Version 2.1 speeds up electronic design verification since it allows a model developed for simulation to run in an emulation environment and vice versa. More...


Mentor Graphics Completes Test Chip with IC Implementation Flow for Common Platform 32/28nm Technology
Mentor Graphics Corporation announced it has collaborated with the Common Platform Alliance (CPA) members, IBM, GLOBALFOUNDRIES and Samsung, to design a test chip using its netlist-to-GDSII solution for CPA 32nm and 28nm high-k metal gate (HKMG) IC manufacturing technologies. More...


More Than Half of US Handset Shipments Will be Smartphones by 2012
The demand for advanced mobile handsets that contain significant processing power, robust memory, large screens, and open operating systems has dominated the mobile phone market for the past several years. More...


STARC and Cadence Develop In-Design DFM for 32/28-Nanometer Silicon Realization
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has teamed with the Semiconductor Technology Academic Research Center (STARC), a Japanese design consortium, and created an innovative new Cadence-based 32/28-nanometer design-for-manufacturing (DFM) flow. More...


First Look At NXP’s Low Power Solutions for 2011
ARM Techcon – November 12, 2010 -- NXP has had great success in this area with the LPC 1100, which was announced at the end of 2009. Next year, the company plans to follow on this success with the LPC 1200, featuring a highly optimized Cortex M0 processor IP. More...


Flexible Techniques for Low-Power 32/28nm Standard Cell and Memory Design
ARM Techcon – November 11, 2010 -- Low-power design encompasses an expanding set of loosely defined and widely deployed techniques for making electronic components more power efficient. Those techniques were the subject of a presentation by Wolfgang Heifricht, platform manager at ARM during ARM TechCon this week. More...


The ARM Ecosystem is the Real Story
ARM Techcon – November 10, 2010 -- The ARM TechCon developer’s conference got underway Tuesday with an extensive lineup of presentations, keynotes and supporting cast members. Indeed, perhaps the most notable aspect of ARM TechCon is the supporting cast. More...


Energy-Efficient Architectures for 4G and LTE Design
ARM Techcon – November 9, 2010 -- Mobile devices have grown up. No longer just for talking and texting, mobile devices are now more powerful than a desktop PC was just one generation ago. That pushes the capabilities of every device in the data pipeline as well, from servers to transmitters and even modems. Still, at every point in the data transmission, there is a crying need for power efficiency. More...


Power ISA Advancement To Enable Full Hardware Virtualization For The Embedded Space
Power.org, the open collaborative organization that enables, develops and promotes Power Architecture technology, has finalized the Power ISA Version 2.06 Revision B, which allows multiple operating systems to run over multiple embedded cores providing the requisite isolation and protection while increasing performance through hardware virtualization. More...


Cadence Unveils Holistic Approach to Silicon Realization
Cadence Design Systems, Inc. today introduced a new holistic approach to Silicon Realization that moves chip development beyond a patchwork of point tools to a streamlined end-to-end path of integrated technology, tools, and methodology. More...


Mentor Embedded Nucleus Real Time Operating System Used in Over 2.3 Billion Mobile Platforms
Mentor Graphics Corporation today announced that the Mentor Embedded Nucleus Real Time Operating System (RTOS) has again topped worldwide adoption in the mobile handset market with use in over 2.345 billion devices, according to the VisionMobile’s 100 Million Club research report. More...


Carbon Nanotube Technology Produces Up to Tenfold Increase in Lithium-Ion Battery Power
Contour Energy Systems, Inc. today announced the acquisition of a breakthrough carbon nanotube technology that can dramatically improve the power capability of lithium-ion batteries, through an exclusive technology licensing agreement with Massachusetts Institute of Technology. More...


New CEO at Lynguent
Lynguent, Inc., a developer of simulation models of analog/mixed-signal (AMS) IC designs, has named Sam Young as its new president and CEO. More...


TI announced as the first licensee of the next generation ARM Cortex-A series processor core
Texas Instruments Incorporated (TI) today confirmed that it was the first company to partner with ARM in the conception and definition of the next generation ARM Cortex-A series processor core (also known as “Eagle”) to be announced later this year. TI intends to use the new processor to further strengthen and extend its future OMAP platform offerings. More...


Cadence and ARM to Create an ARM-Optimized System Realization Solution
Cadence Design Systems, Inc. has announced a broadening of its existing collaboration with ARM to develop an optimized System Realization solution for ARM processors that will enable an end-to-end flow including a full set of interoperable tools, ARM processor and physical IP, services and methodology from embedded Linux to GDSII. More...


ARM and TSMC Sign Long-Term Strategic Agreement
ARM and Taiwan Semiconductor Manufacturing Company, Ltd. today jointly announced a long-term agreement that provides TSMC with access to a broad range of ARM processors and enables the development of ARM physical IP across TSMC technology nodes.  More...


500,000 new 4G Subscriptions in 2010; but Increase is Regional, says In-Stat
4G technology deployments and subscriptions will begin to take root in 2010 but only in North America and Western Europe reports In-Stat (www.in-stat.com). The rest of the world won’t begin to embrace 4G Technology in any significant way until 2012. More...


EDA Consortium Reports Revenue Increase for Q1 2010
The EDA Consortium Market Statistics Service today (7/12/10) announced that the Electronic Design Automation (EDA) industry revenue for Q1 2010 was $1,247 million, a 4.6 percent increase compared to $1,192.1 million in Q1 2009. Sequential EDA revenue declined 1.2 percent, while over the last four quarters it declined 5.9 percent. More...


Embedded Insights Launches Embedded Processing Directory
Embedded Insights, Inc today launched its Embedded Processing Directory, a live online resource that allows embedded developers to evaluate and compare embedded processors from over 80 vendors based on processor size, processor type, instruction set, target applications, and vendor name. More...


Europe's 2009 Energy Growth Dominated by Renewables
The European Commission's Joint Research Centre released its annual "Renewable Energy Snapshots" report this week, and found that 62 percent of all new electricity generation installed in 2009 in the 27 EU member countries was from renewable sources. This represented an increase from 2008, when 57 percent of new electricity was renewable. More...


Bluetooth SIG Adopts Low-Energy Spec
The Bluetooth Special Interest Group (SIG) today announced the formal adoption of Bluetooth Core Specification Version 4.0, with the hallmark feature, low energy technology. This final step in the adoption process signals to Bluetooth SIG members that the Bluetooth SIG Qualification Program is now open for qualification of all Bluetooth product types to the Version 4.0 Specification. More...


Mentor @DAC Extended
If you missed DAC in June or regret having missed some tutorials, you can catch up in July. Mentor @ DAC Extended is an online presentation of 22 of Mentor's DAC 2010 suite sessions. More...


ARM, IBM, Samsung, GLOBALFOUNDRIES and Synopsys Announce Delivery of 32/28nm HKMG Vertically Optimized Design Platform
ARM, IBM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys, Inc. today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices. More...


ARM Accelerates Software Development on Hardware-Assisted Verification Systems with VSTREAM
ARM has announced the availability of the ARM VSTREAM virtual debug interface; a fast and flexible virtual link that connects software debuggers to hardware assisted verification systems. VSTREAM enables more efficient software development in the early stages of system design, improving the utilization of hardware resources and reducing project risk and time-to-market for new ARM processor-based devices. More...


ON Semiconductor Acquires Sound Design Technologies
ON Semiconductor Corporation today announced it has acquired privately held Sound Design Technologies, Ltd. (SDT) from an affiliate of Global Equity Capital, LLC, in an all cash transaction for initial consideration of approximately $22 million. More...


Cadence Announces Comprehensive SOI Design Hub
Cadence Design Systems, Inc. has introduced the Cadence SOI Design Hub, a new Web portal that lowers the barriers to adopting silicon-on-insulator (SOI) technology through comprehensive silicon-proven design enablement solutions and services. The SOI Design Hub is aimed at reducing SOI adoption start-up costs, cutting time to market for SOI intellectual property (IP), and improving design quality. More...


Mobile Data Traffic from PC Modems and Routers Will Increase Fourfold by 2014
Mobile data traffic from PC modems and routers is forecast to increase fourfold between 2010 and 2014, according to a new Research Brief from ABI Research. This year some 2,000 petabytes of data will be sent and received, a figure that will rise to about 8,000 petabytes in 2014. More...


Mobile Broadband Subscriptions Surpassed 271 Million by Year End 2009
GSM subscriber growth, on an absolute basis, is slowly grinding to a halt. According to forecasts from ABI Research that growth is expected to flatline by mid-2011. More...


2010 DesignVision Awards Announced
The International Engineering Consortium (IEC) today announced the winners of the 2010 DesignVision Awards program celebrating the premier design tools and products judged as the most unique and beneficial to the semiconductor industry. IEC Executive Vice President Roger Plummer presented the DesignVision Awards live before the Tuesday Keynote Address. More...


Over 1 Billion Global Broadband Subscribers by 2013
Consumer enthusiasm for broadband service continues unabated, reports In-Stat. During calendar year 2009, an average of 8.8 million new broadband subscribers worldwide signed up for service each month. By 2013, In-Stat forecasts that the number of global broadband subscribers will surpass 1 billion. More...


Call for Papers for nanoPower Forum
An Announcement and Call for Papers has been issued for the fourth-annual international nanoPower Forum (nPF ’10) to be held May 17-19 at the Doubletree Hotel, Santa Ana/Orange County Airport, California. This focused three-day international conference will serve an audience of decision makers who are interested in learning about and contributing to the latest practical advancements related to the emerging area of “ultra-low power” (ULP) systems. More...


802.11n To Feature in 87% of Wi-Fi-Enabled Smartphones in 2014
Although 802.11n Wi-Fi technology was found in less than 1% of Wi-Fi-enabled smartphones last year, in 2014 at least 87% of Wi-Fi-capable smartphones will feature this latest of the 802.11 protocols. However, users of these phones shouldn’t expect laptop-like performance, at least not initially. More...


One Billion People Will Own a Smartphone by 2013
Despite the increasing overlap between mobile phone functionality and other handheld devices, consumers are still purchasing standalone cameras, sat navs, personal media players and handheld gaming devices, according to a new convergence report from Futuresource Consulting. More...


LTE Drives the News but WCDMA Drives Base Station Deployments
Despite a poor worldwide economy, demand for smartphones, regular phones, and wireless broadband services continues to drive the base station market, according to In-Stat. The number of newly deployed macro cellular base stations will grow over 10% in 2009. More...


Mobile Device Shipments Will Nearly Double Before 2015
2009 will see a total of 1.2 billion mobile devices shipped, according to the latest data from ABI Research. That includes all categories of wireless devices including cellular handsets, MIDs (Mobile Internet Devices), netbooks, mobile consumer electronics products, and cellular modems. More...


MIPS and Tensilica Team to Accelerate SOC Design Activity on Android Platform
MIPS Technologies and Tensilica today announced they are working together to accelerate SOC (system-on-chip) design activity on the popular Android platform. Together, MIPS and Tensilica will help companies speed the design of new home entertainment and mobile consumer products based on Android. More...


Billion Dollar Market for Remote Radio Heads in 2014
The demands of cost reduction and greater efficiency in cellular base station design are leading to a rapidly growing market for remote radio heads. According to a new study from ABI Research, this market is on track to exceed a value of $1 billion in 2014. More...


Multi-Core Processors to Reach 88% of Mobile Processors Shipped in 2013
Although multi-core processors are common today in notebook PCs, they are only beginning to become common place in other mobile devices, according to In-Stat. In-Stat projects 2010 will be a key year for adoption of multi-core processors in netbooks and smartphones in 2010, while MIDs/UMPCs will see uptake in 2011, and CE devices will follow during 2012/2013. More...


Virage Logic Turns Over a High Card
Virage Logic announced today that it had completed its acquisition of NXP’s horizontal advanced CMOS semiconductor IP (SIP) technology. As part of the acquisition, approximately 150 former NXP employees and the assets associated with selected NXP advanced CMOS libraries, IP blocks and SoC infrastructure along with other classes of semiconductor IP, including approximately 25 associated patent families, are now part of Virage Logic. Virage and NXP also inked a $65 million strategic alliance that will give Virage cash flow and customers for many years. That’s part of the story, but Virage’s strategy going forward is the interesting part. More...


Bada Joins Android and Others in the Battle for Mobile OS Supremacy
Samsung Electronics will unveil its new open mobile platform, Bada, next month. Samsung seems to be following a trend of OSs that is “open” yet proprietary. The name "Bada" is Korean for "ocean." Market research firm In-Stat believes the name is ironically appropriate as it highlights the almost limitless variety of mobile OSs as Bada joins Symbian, Android, Maemo, LiMo, WebOS, Windows Mobile, RIM, OSX, and Moblin to name a few. More...


Smartphone Market Driven by Operating System Wars and Feature Migration
While iPhone shipments are growing quickly, smartphones based on the Symbian operating system remain dominant and will continue to grow over the next several years, reports In-Stat. However, Symbian will wane, resulting a drop in net handset shipments in 2014. More...

Microsite and Reference Designs for Smart-Grid Metering
Power Integrations today launched a new technical microsite, www.powerint.com/smartmeters, focusing on energy-efficient power supply solutions for utility meters used in smart-grid energy networks. More...

The Portable Consumer Electronics Market in Europe
Netbooks, pocket video cameras, digital SLRs, smartphones, mobile Internet devices and handheld games consoles are fuelling growth in the European portable electronics market this year, which in the face of economic challenges and convergence, grew 18% in 2008 to reach 155 million units and is forecast to grow a further 7% in 2009 to reach close to 170 million units. More...

Solar, Wind Power Enable ‘Green’ Cell Base Station Market
In the last few years, the number of worldwide cellular base stations has exploded from the hundreds of thousands to the many millions, creating greenhouse gases and pollution from the power required to run them, reports In-Stat. Base stations on an electric grid aren’t the real problem, but as cellular spreads to billions of people in emerging countries, off-grid base stations, which are usually powered by diesel generators running 24/7, proliferate. More...

Mobile VoIP Could Transform Mobile Landscape
SCOTTSDALE, Ariz., Sept. 15, 2009 – Mobile VoIP is moving beyond its initial function as a new mechanism to get inexpensive international calls, reports In-Stat. While Mobile VoIP still poses a direct threat to operator voice revenue, it also represents a dynamic new capability that promises numerous applications. In-Stat projects that by 2013 Mobile VoIP applications will generate annual revenues of $32.2 billion, driven by over 278 million registered users worldwide. More...

One Billion Wi-Fi Chipsets to Ship in 2011 Alone
NEW YORK - August 18, 2009 - Wi-Fi seems to be all-pervasive, and in the year 2011 alone, Wi-Fi chipset vendors will ship one billion units, according to market data just released by ABI Research. By the end of the following year a cumulative five billion such chipsets will have shipped since the firm began tracking Wi-Fi chipsets in 2000. More...

Virage Logic Announces Intent to Acquire ARC International
Virage Logic logo August 18, 2009 -- Virage Logic Corporation today announced its intent to acquire publicly held ARC International plc. The proposed acquisition would expand Virage Logic's ability to serve the global semiconductor market by complementing its existing portfolio of physical IP and standards-based advanced interface IP with ARC’s processor IP, a necessary component for complex System-on-Chip (SoC) integrated circuits. More...

Abilis Acquires Two Product Lines From Freescale Semiconductor
GENEVA, August 17-- Abilis Systems, a Kudelski Group company, (SWX:KUD) and a pioneer RF semiconductor company, announces the acquisition of Freescale Semiconductor CMOS Modulators and Silicon Tuner product lines. More...

IBM Scientists Use DNA Scaffolding To Build Tiny Circuit Boards
SAN JOSE, Calif., Aug. 17 -- Today scientists at IBM Research and the California Institute of Technology announced a scientific advancement that could be a major breakthrough in enabling the semiconductor industry to pack more power and speed into tiny computer chips, while making them more energy efficient and less expensive to manufacture. More...

Does Your Car Get 230 MPG?
WARREN, Mich. — General Motors said Tuesday that its Chevrolet Volt extended-range electric vehicle, scheduled for release in 2011, would achieve a fuel rating of 230 miles a gallon in city driving. More...







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